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Genera
Properties and Features of Copper
(동의
일반적인 성질) |
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* Physical
Properties of Copper.
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| Property |
Value |
Units |
Value |
Units |
| Atomic number |
29 |
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|
|
| Atomic weight |
63.54 |
|
|
|
| Lattice structure |
face centered cubic(fcc) |
| Density |
| IEC standrad value(1913) |
8.89 |
g/cm3 |
0.321 |
lb/in3 |
| Typical value at 20°C |
8.92 |
g/cm3 |
0.322 |
lb/in3 |
| at 1083°C (solid) |
8.32 |
g/cm3 |
0.3 |
lb/in3 |
| at 1083 (liquid) |
7.99 |
g/cm3 |
0.288 |
lb/in3 |
| Melting point |
1083 |
°C |
1981 |
°F |
| Boiling point |
2595 |
°C |
4703 |
°F |
| Linear cofficient of thermal
expansion at: |
| -253°C, -423°F |
0.3 x 10-6 |
/°C |
0.17 x 10-6 |
/°F |
| -183°C, -297°F |
9.5 x 10-6 |
/°C |
5.28 x 10-6 |
/°F |
| -191°C to 16°C,-312-61°F |
14.1 x 10-6 |
/°C |
7.83 x 10 |
/°F |
| 25°C to 100°C,77-212
°F |
16.8 x 10-6 |
/°C |
9.33 x 10-6 |
/°F |
| 20°C to 200°C,68-392
°F |
17.3 x 10-6 |
/°C |
9.61 x 10-6 |
/°F |
| 20°C to 300°C,68-572
°F |
17.7 x 10-6 |
/°C |
9.83 x 10-6 |
/°F |
| Specific heat (thermal capacity)
at: |
| -253°C, -425°F |
0.013 |
J/g°C |
0.0031 |
Btu/lb°F |
| -150°C, -238°F |
0.282 |
J/g°C |
0.0674 |
Btu/lb°F |
| -50°C, -58°F |
0.361 |
J/g°C |
0.0862 |
Btu/lb°F |
| 20°C, 68°F |
0.386 |
J/g°C |
0.0921 |
Btu/lb°F |
| 100°C, 212°F |
0.393 |
J/g°C |
0.0939 |
Btu/lb°F |
| 200°C, 392°F |
0.403 |
J/g°C |
0.0963 |
Btu/lb°F |
| Thermal conductivity at: |
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|
| -253°C, -425
°F |
12.98 |
W-cm/cm2·°C |
750 |
Btu/ft/ft2h°F |
| -200°C, -328 °F |
5.74 |
W-cm/cm2·°C |
330 |
Btu/ft/ft2h°F |
| -183°C, -297 °F |
4.73 |
W-cm/cm2·°C |
270 |
Btu/ft/ft2h°F |
| -100°C, -148 °F |
4.35 |
W-cm/cm2·°C |
252 |
Btu/ft/ft2h°F |
| 20°C, 68 °F |
3.94 |
W-cm/cm2·°C |
227 |
Btu/ft/ft2h°F |
| 100°C, 212 °F |
3.85 |
W-cm/cm2·°C |
223 |
Btu/ft/ft2h°F |
| 200°C, 392 °F |
3.81 |
W-cm/cm2·°C |
220 |
Btu/ft/ft2h°F |
| 300°C, 572 °F |
3.77 |
W-cm/cm2·°C |
217 |
Btu/ft/ft2h°F |
| Electrical conductivity (volume)
at: |
| 20°C, 68 °F,
(annealed) |
58.0-58.9 |
MS/m (m/Ωmm2) |
100.0-101.5 |
% IACS |
| 20°C, 68 °F,
(fully cold worked) |
56.3 |
MS/m (m/Ω·mm2) |
97 |
% IACS |
| Electrical resistivity (volume)
at: |
| 20°C, 68 °F,
(annealed) |
0.017241-0.0170 |
Ω·mm2/m |
10.371-10.2 |
Ω(circmil/ft) |
| 20°C, 68 °F,
(annealed) |
1.7241-1.70 |
µΩ·cm |
0.6788-0.669 |
micrΩ-in |
| 20°C, 68 °F,
(fully cold worked) |
0.0178 |
Ω·mm2/m |
10.7 |
Ω(circmil/ft) |
| 20°C, 68 °F,
(fully cold worked) |
1.78 |
µΩ·cm |
0.7 |
µΩ-in |
| Electrical resistivity (mass)
at 20°C, 68 °F, (annealed) |
| Mandatory maximum |
0.15328 |
Ω·g/m2 |
875.4 |
Ω·lb/mile2 |
| Temperature coefficient of
electrical resistance (a) at 20°C °F:
Annealed copper of 100% IACS (applicable
from -100°C to 200°C,212°F to
392°F) |
0.00393 |
/°C |
0.00218 |
/°F |
| Fully cold worked copper
of 97%IACS (applicable from 0°C to 100°C,
68-212 °F) |
0.00381 |
/°C |
0.00238 |
/°F |
| Modulus of elasticity (tension)
at 20°C:, 68 °F |
| Annealed |
118,000 |
MPa |
17 x 103 |
KSi |
| Cold worked |
118,000-132,000 |
MPa |
17-19 x 103 |
KSi |
| Modulus of rigidity (torsion)
at 20°C, 68 °F |
| Annealed |
44,000 |
Mpa |
6.4 x 103 |
KSi |
| Cold worked |
44,000-49,000 |
MPa |
6.4-7 x 103 |
KSi |
| Latent heat of fusion |
205 |
J/g |
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| Electro chemical equivalent
for: |
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| Cu++ |
0.329 |
Mg/C |
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| Cu+ |
0.659 |
Mg/C |
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| Normal electrode potential (hydrogen
electrode) for: |
| Cu++ |
-0.344 |
V |
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| Cu+ |
-0.47 |
V |
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* Physical and Mechanical
Properties of Electrical Grades of Copper and Aluminum
(Type 1350) Compared. |
| Property |
Units |
Copper |
Aluminum
(1350) |
| (High
Conductivity) |
Electrical
conductivity
(annealed) |
%IACS |
101 |
61 |
Electrical
resistivity
(annealed) |
µΩ-cm |
1.72 |
2.83 |
Thermal
conductivity
at 20°C |
W/m·K |
397 |
230 |
Coefficient
of
expansion |
/°C |
17 x 10-6 |
23 x 10-6 |
| /°F |
9.4 x 10-6 |
12.8 x 10-6 |
Tensile
strength
(annealed) |
KSi |
29.0-36.2 |
7.2-8.7 |
| MPa |
200-250 |
50-60 |
Tensile
strength
(half-hard) |
KSi |
37.7-43.5 |
12.3-14.5 |
| MPa |
260-300 |
85-100 |
0.2%
yield strength
(annealed) |
KSi |
72.5-79.8 |
2.9-4.3 |
| MPa |
50-55 |
20-30 |
0.2%
yield strength
(half-hard) |
KSi |
24.6-29.0 |
8.7-9.4 |
| MPa |
170-200 |
60-65 |
| Elastic
modulus |
KSi |
16.8-18.8 |
10.1 |
| MPa |
116-130 |
70 |
Fatigue
Strength
(annealed) |
KSi |
9 |
5.07 |
| MPa |
62 |
35 |
Fatigue
Strength
(half hard) |
KSi |
16.9 |
7.25 |
| MPa |
117 |
50 |
| Specific
heat |
Btu/lb0F |
0.092 |
0.215 |
| J/kg·K |
385 |
900 |
| Density |
g/cm3 |
8.91 |
2.7 |
| lb/in3 |
0.322 |
0.0975 |
| Melting
Point |
°C |
1083 |
660 |
| °F |
1981 |
1220 |
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* Crystallographic
Features of Copper |
| Type
of Structure |
A1 |
| Space
Group |
Oh5
- Fm3m |
| Crystal
Structure |
face-centered
cubic |
| Number
of Atoms per Unit Cell |
4 |
| Lattice
Parameters at 293 K |
3.6147 x 10-10
m |
| Distance
of Closest Atomic Approach |
2.556
x 10-10m |
| (Burgers
vector) at 293 |
| Goldschmidt
Atomic Radii |
1.28
x 10-10m |
| (12-fold
coordination) |
| Atomic
Volume |
1.182 10-29m3 |
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source:
1. Properties of Copper and Copper
Alloys at Cryogenic
Temperatures,
N.J. Simon, E.S. Drexler, and R.P. Reed
2. CDA(Copper
Development Association)
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